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5 ·MOSFET Wafer Thinning 。100um Backside Wet Etching 、。
Taping ； Non Taiko Grinding / Conventional Grinding Backside Wet Etching ；
·WELDING PROCESS Download as a PDF or view online for free Rightward technique or Back hand welding method 05/06/16 Hareesha N G Asst Prof DSCE Bengaluru 53 54 Leftward Technique • The welder holds welding torch in his right hand and filler rod in the left hand • The welding flame is directed away from the finished weld i
·Grinding Grinding is a process which utilizes the use of abrasive particles bounded together to produce superior surface finishing An abrasive is a small nonmetallic hard particle having sharp edges and an irregular shape Types of Abrasives Conventional Aluminum oxide Silicon carbide
·Grinding Process Grinding is a surface finishing operation where very thin layer of material is removed in the form of dust particles Thickness of material removed is in range of to mm Tool used is a abrasive wheel Grinding machine is a power operated machine tool where the work piece is fed
·3 Grinding Grinding is the most common form of abrasive machining It is a material cutting process which engages an abrasive tool whose cutting elements are grains of abrasive material known as grit These grits are characterized by sharp cutting points high hot hardness chemical stability and wear resistance The grits are held together by a suitable
·2002©John Wiley & Sons Inc M P Groover Fundamentals of Modern Manufacturing 2/e Material removal by action of hard abrasive particles usually in the form of a bonded wheel • Generally used as finishing operations after part geometry has been established by conventional machining • Grinding is most important abrasive process
·Usually back grinding is carried out in two steps coarse grinding and fine grinding Coarse grinding employs a coarse grinding wheel with larger diamond abrasives to remove majority of the total removal amount required as well as a faster feedrate to achieve higher throughput the number of wafers processed within unit time
·3 CNC Computer Numeric Control Computer Numeric Control CNC is the automation of machine tools that are operated by precisely programmed commands encoded on a storage medium computer command module usually located on the device as opposed to controlled manually by hand wheels or levers or mechanically automated by cams alone In
Taiko Grinding ProPowertek50um Spin Etching 。 Vacuum Mount 、 Taiko Ring Remove 。
Taping ； Non Taiko Grinding / Conventional Grinding Backside Wet Etching ；
·5 Gear forming In gear form cutting the cutting edge of the cutting tool has a shape identical with the shape of the space between the gear teeth Two machining operations milling and broaching can be employed to form cut gear teeth Form milling In form milling the cutter called a form cutter travels axially along the length of the gear tooth at the appropriate
FOL Back Grinding Taping Back Grinding De Taping Wafer （8mils 10mils）； ：5° 24； Raw Material in Assembly
·Though the difference between the DBG process and the standard back grinding process is just the process sequence ultra thin wafer state actually does not exist in DBG process due to the formation of separated die when the wafer is thinned Thus the dicing speed could be increased due to the reduction of backside chipping risk and the
·Back End BE Process Wafer Back Grinding • The typical wafer supplied from wafer fab is 600 to 750μm thick • Wafer thinned down to the required thickness 50um to 75um by abrasive grinding wheel › 1st step Use a large grit to coarsely grind the wafer and
·11 GRADE OF THE WHEEL Structure of the grinding wheel represents to the grain spacing or the manner in which the abrasive grains are distributed throughout the wheel The entire volume is occupied by abrasive grains bonding material and pores The primary purpose of structure is to provide chip clearance and it may be open medium or dense
·The Principle of Wafer Back Grinding Process Figure1illustrates the principle of wafer backside grinding process The wafer is mounted on a porous ceramics chuck table and a cup shaped grinding wheel is held on an aerostatic spindle The spindle axis is offset by a distance relative to the chuck table
·3 MachiningMachining A material removal process in which a sharp cutting tool is used to mechanically cut away material so that the desired part geometry remains Most common application to shape metal parts Machining is the most versatile and accurate of all manufacturing processes in its capability to produce a diversity of part geometries and
·21 INTRODUCTION • Stud welding is a high speed metal fastening process in which a metal fastener can be applied by a welding arc to another piece of metal • Weld studs come in a variety of designs and shapes for a wide range of applications • A weld stud can be end joined to a metal work piece instantaneously for a high quality high strength permanent
·8 Types of Grinding 1 Surface Grinder The surface grinding machine is used for grinding flat surfaces The workpiece is supported on a rectangular table which moves back and forth and reciprocates beneath the grinding wheel A surface grinder consists of an abrasive wheel a chuck a workpiece holding device and a rotary table The chuck is used to hold the
·5 HOW THE CENTERLESS GRINDING WORKS The work rest blade supports the part slightly It is made of wear resistant material The regulating wheel rotates the Cylindrical parts It is commonly made of plastic or rubber bond The actual grinding is performed by Grinding wheel Both the wheel must be periodically dressed and trued to maintain precise roundness
·The back grinding process shares a fundamental material removal mechanism with the single point diamond scratch test Consequently it becomes feasible to predict the depth of subsurface damage SSD through the principles of scratch theory Furthermore by leveraging the similarities between the indentation and scratch generation processes it
A crucial prerequisite for an efficient precise grinding process is preparing or conditioning the grinding tool according to process requirements Grinding tool surface microtopography and
·The wafer backside grinding process has been a crucial technology to realize multi layer stacking and chip performance improvement in the three dimension integrated circuits 3D IC manufacturing
